Silicate Spin-on-Glass as an Overcoat Layer for SiO2 Ridge Waveguides

Matthew A. Stott1, Thomas A. Wall1, Damla Ozcelik2, Joshua W. Parks2, Gopikrishnan G. Meena2, Erik Hamilton1, Roger Chu1, Holger Schmidt2 and Aaron R. Hawkins1 1Department of Electrical and Computer Engineering, Brigham Young University, 459 Clyde Building, Provo,...

Ga2O3 MOSFETs Using Spin-On-Glass Source/Drain Doping Technology

Ga2O3 MOSFETs Using Spin-On-Glass Source/Drain Doping Technology Ke Zeng, Joshua S. Wallace, Christopher Heimburger, Kohei Sasaki, Akito Kuramata, Takekazu Masui, Joseph A. Gardella Jr., and Uttam Singisetti, Member, IEEE Read full Article Here:...

SOG Customer Application Questions & Answers

We would like to use your SOD as a source for dopants, we are currently interested in sources for B, P and As, and have some questions regarding that process: 1. Being a research facility, using the same tools for various processes we are cautious when introducing new...

Benefits of Wafer Bonding

Almost any flat substrates can be bonded to each other, including silicon, GaAs, InP, glass, quartz, ceramic, aluminum and other metals. Wafers with thin films, such as oxides, metals, nitrides and others, can also be bonded.