Almost any flat substrates can be bonded to each other, including silicon, GaAs, InP, glass, quartz, ceramic, aluminum and other metals.
Wafers with thin films, such as oxides, metals, nitrides and others, can also be bonded.
Almost any flat substrates can be bonded to each other, including silicon, GaAs, InP, glass, quartz, ceramic, aluminum and other metals.
Wafers with thin films, such as oxides, metals, nitrides and others, can also be bonded.