Desert Silicon is now offering wafer bonding services in our class 100 wafer bonding clean room.
1 inch to 6 inch wafers can be bonded together utilizing BCB adhesive bonding.

Nicely established process for adhesive wafer bonding utilizing BCB (benzocyclobutene).
We can do wafers up to 6 inch in diameter at vacuum levels of 5 X 10-3 (utilizing roughing and turbo pumps).
Upper and lower electrode temperature ramping capability up to 450C.

A large variety of substrates can be accommodated.
See data sheet, or call or email for details.