by Kent | Feb 15, 2017 | Current Future Apps, Media
We would like to use your SOD as a source for dopants, we are currently interested in sources for B, P and As, and have some questions regarding that process: 1. Being a research facility, using the same tools for various processes we are cautious when introducing new...
by Kent | Nov 11, 2016 | Current Future Apps, Media
Almost any flat substrates can be bonded to each other, including silicon, GaAs, InP, glass, quartz, ceramic, aluminum and other metals. Wafers with thin films, such as oxides, metals, nitrides and others, can also be bonded.
